HSB40-252510P

HSB40-252510P
HSB40-252510P Alternate View

HSB40-252510P

25 x 25 mm, BGA Heat Sink, Aluminum, PCB, Push Pins

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 17.87
Thermal Resistance @ 1 W, nat conv (°C/W) 19.5
Thermal Resistance @ 1 W, 200 LFM (°C/W) 6
Thermal Resistance @ 1 W, 400 LFM (°C/W) 3.7
Power Dissipation @ 75°C ΔT, nat conv (W) 4.2
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 25 x 25 x 10
Dimensions LxWxH (in) 0.984 x 0.984 x 0.394
Thermal Pad No

Technical Docs

Datasheet

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