HSB28-606022

HSB28-606022
HSB28-606022 Alternate View

HSB28-606022

60 x 60 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 4.74
Thermal Resistance @ 1 W, nat conv (°C/W) 5.1
Thermal Resistance @ 1 W, 200 LFM (°C/W) 1.4
Thermal Resistance @ 1 W, 400 LFM (°C/W) 0.9
Power Dissipation @ 75°C ΔT, nat conv (W) 15.83
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 60 x 60 x 22
Dimensions LxWxH (in) 2.36 x 2.36 x 0.87

Technical Docs

Datasheet 3D Model

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