HSB27-434316

HSB27-434316
HSB27-434316 Alternate View

HSB27-434316

43.1 x 43.1 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 8.35
Thermal Resistance @ 1 W, nat conv (°C/W) 9.6
Thermal Resistance @ 1 W, 200 LFM (°C/W) 2.8
Thermal Resistance @ 1 W, 400 LFM (°C/W) 1.6
Power Dissipation @ 75°C ΔT, nat conv (W) 8.98
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 43.1 x 43.1 x 16.51
Dimensions LxWxH (in) 1.7 x 1.7 x 0.65

Technical Docs

Datasheet 3D Model

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