HSB01-080808

HSB01-080808
HSB01-080808 Alternate View

HSB01-080808

8.5 x 8.5 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 39.1
Thermal Resistance @ 1 W, nat conv (°C/W) 43.3
Thermal Resistance @ 1 W, 200 LFM (°C/W) 16
Thermal Resistance @ 1 W, 400 LFM (°C/W) 11.2
Power Dissipation @ 75°C ΔT, nat conv (W) 1.92
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 8.5 x 8.5 x 8
Dimensions LxWxH (in) 0.33 x 0.33 x 0.31

Technical Docs

Datasheet 3D Model

Buy from Same Sky

Loading...

Shop our distributors

Featured Products

All Heat Sinks Categories