HSB45-383818

HSB45-383818
HSB45-383818 Alternate View

HSB45-383818

38.1 x 38.1 mm, BGA Heat Sink, Copper, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 10.05
Thermal Resistance @ 1 W, nat conv (°C/W) 13.5
Thermal Resistance @ 1 W, 200 LFM (°C/W) 2.9
Thermal Resistance @ 1 W, 400 LFM (°C/W) 1.7
Power Dissipation @ 75°C ΔT, nat conv (W) 7.46
Material Copper
Material Finish Clean
Dimensions LxWxH (mm) 38.1 x 38.1 x 18
Dimensions LxWxH (in) 1.5 x 1.5 x 0.71
Thermal Pad No

Technical Docs

Datasheet

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