HSB35-272725

HSB35-272725
HSB35-272725 Alternate View

HSB35-272725

27 x 27 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 8.74
Thermal Resistance @ 1 W, nat conv (°C/W) 12.1
Thermal Resistance @ 1 W, 200 LFM (°C/W) 2.9
Thermal Resistance @ 1 W, 400 LFM (°C/W) 1.9
Power Dissipation @ 75°C ΔT, nat conv (W) 8.59
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 27 x 27 x 25
Dimensions LxWxH (in) 1.06 x 1.06 x 0.984
Thermal Pad No

Technical Docs

Datasheet

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