HSB31-212105

HSB31-212105
HSB31-212105 Alternate View

HSB31-212105

21 x 21 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 25.33
Thermal Resistance @ 1 W, nat conv (°C/W) 28.5
Thermal Resistance @ 1 W, 200 LFM (°C/W) 9.9
Thermal Resistance @ 1 W, 400 LFM (°C/W) 6.7
Power Dissipation @ 75°C ΔT, nat conv (W) 2.96
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 21 x 21 x 5
Dimensions LxWxH (in) 0.827 x 0.827 x 0.2
Thermal Pad No

Technical Docs

Datasheet

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