HSB19-272718

HSB19-272718
HSB19-272718 Alternate View

HSB19-272718

27 x 27 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Rth = Thermal Resistance, PD = Power Dissipation

Type Description
Select
Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 11.11
Thermal Resistance @ 1 W, nat conv (°C/W) 14.7
Thermal Resistance @ 1 W, 200 LFM (°C/W) 4.5
Thermal Resistance @ 1 W, 400 LFM (°C/W) 3.3
Power Dissipation @ 75°C ΔT, nat conv (W) 6.75
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 27 x 27 x 18
Dimensions LxWxH (in) 1.06 x 1.06 x 0.71

Technical Docs

Datasheet 3D Model

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