HSB13-303014

HSB13-303014
HSB13-303014 Alternate View

HSB13-303014

30.7 x 30.7 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Rth = Thermal Resistance, PD = Power Dissipation

Type Description
Select
Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 12.36
Thermal Resistance @ 1 W, nat conv (°C/W) 14.8
Thermal Resistance @ 1 W, 200 LFM (°C/W) 4.7
Thermal Resistance @ 1 W, 400 LFM (°C/W) 3.4
Power Dissipation @ 75°C ΔT, nat conv (W) 6.07
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 30.7 x 30.7 x 14.1
Dimensions LxWxH (in) 1.21 x 1.21 x 0.56

Technical Docs

Datasheet 3D Model

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