HSB11-252518

HSB11-252518
HSB11-252518 Alternate View

HSB11-252518

25 x 25 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Rth = Thermal Resistance, PD = Power Dissipation

Type Description
Select
Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 13.7
Thermal Resistance @ 1 W, nat conv (°C/W) 16.8
Thermal Resistance @ 1 W, 200 LFM (°C/W) 4.5
Thermal Resistance @ 1 W, 400 LFM (°C/W) 3.1
Power Dissipation @ 75°C ΔT, nat conv (W) 5.47
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 25 x 25 x 18
Dimensions LxWxH (in) 0.98 x 0.98 x 0.71

Technical Docs

Datasheet 3D Model

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