HSB10-232306

HSB10-232306
HSB10-232306 Alternate View

HSB10-232306

23 x 23 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Rth = Thermal Resistance, PD = Power Dissipation

Type Description
Select
Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 25.46
Thermal Resistance @ 1 W, nat conv (°C/W) 29.2
Thermal Resistance @ 1 W, 200 LFM (°C/W) 9.6
Thermal Resistance @ 1 W, 400 LFM (°C/W) 6.7
Power Dissipation @ 75°C ΔT, nat conv (W) 2.95
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 23 x 23 x 6
Dimensions LxWxH (in) 0.91 x 0.91 x 0.24

Technical Docs

Datasheet 3D Model

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