HSB05-171711

HSB05-171711
HSB05-171711 Alternate View

HSB05-171711

17 x 17 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Rth = Thermal Resistance, PD = Power Dissipation

Type Description
Select
Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 23.91
Thermal Resistance @ 1 W, nat conv (°C/W) 29.1
Thermal Resistance @ 1 W, 200 LFM (°C/W) 8.4
Thermal Resistance @ 1 W, 400 LFM (°C/W) 5.8
Power Dissipation @ 75°C ΔT, nat conv (W) 3.14
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 17 x 17 x 11.5
Dimensions LxWxH (in) 0.67 x 0.67 x 0.45

Technical Docs

Datasheet 3D Model

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