HSB03-141406

HSB03-141406
HSB03-141406 Alternate View

HSB03-141406

14 x 14 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Rth = Thermal Resistance, PD = Power Dissipation

Type Description
Select
Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 35.98
Thermal Resistance @ 1 W, nat conv (°C/W) 39.7
Thermal Resistance @ 1 W, 200 LFM (°C/W) 15.8
Thermal Resistance @ 1 W, 400 LFM (°C/W) 11.6
Power Dissipation @ 75°C ΔT, nat conv (W) 2.08
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 14 x 14 x 6
Dimensions LxWxH (in) 0.55 x 0.55 x 0.24

Technical Docs

Datasheet 3D Model

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