HSB41-303014P

HSB41-303014P
HSB41-303014P Alternate View

HSB41-303014P

30 x 30 mm, BGA Heat Sink, Aluminum, PCB, Push Pins

Datasheet

Specifications

Rth = Thermal Resistance, PD = Power Dissipation

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 12.63
Thermal Resistance @ 1 W, nat conv (°C/W) 15.1
Thermal Resistance @ 1 W, 200 LFM (°C/W) 4.3
Thermal Resistance @ 1 W, 400 LFM (°C/W) 2.9
Power Dissipation @ 75°C ΔT, nat conv (W) 5.94
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 30 x 30 x 14
Dimensions LxWxH (in) 1.18 x 1.18 x 0.551
Thermal Pad No

Technical Docs

Datasheet

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