HSB26-343408

HSB26-343408

33.5 x 33.5 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Rth = Thermal Resistance, PD = Power Dissipation

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 15.19
Thermal Resistance @ 1 W, nat conv (°C/W) 17.9
Thermal Resistance @ 1 W, 200 LFM (°C/W) 5.3
Thermal Resistance @ 1 W, 400 LFM (°C/W) 3.2
Power Dissipation @ 75°C ΔT, nat conv (W) 4.94
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 33.5 x 33.5 x 8
Dimensions LxWxH (in) 1.32 x 1.32 x 0.32

Technical Docs

Datasheet 3D Model

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