HSB07-202009

HSB07-202009
HSB07-202009 Alternate View

HSB07-202009

20 x 20 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Rth = Thermal Resistance, PD = Power Dissipation

Type Description
Select
Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 24.08
Thermal Resistance @ 1 W, nat conv (°C/W) 29.2
Thermal Resistance @ 1 W, 200 LFM (°C/W) 8.6
Thermal Resistance @ 1 W, 400 LFM (°C/W) 6
Power Dissipation @ 75°C ΔT, nat conv (W) 3.11
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 20 x 20 x 9
Dimensions LxWxH (in) 0.79 x 0.79 x 0.35

Technical Docs

Datasheet 3D Model

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